Oven wall compositions and/or structures

ABSTRACT

Techniques regarding the composition and/or structure of oven walls are provided. For example, one or more embodiments described herein can comprise an oven with a heat source configured to heat a hollow space within the oven. The oven further can comprise an oven body that can define the hollow space. Also, the oven body can comprise a plurality of connected sides, wherein one or more of the connected sides comprise a plurality of carbon nanotubes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationSer. No. 62/611,799 filed on Dec. 29, 2017, entitled “OVEN WALLCOMPOSITIONS AND/OR STRUCTURES” and U.S. patent application Ser. No.15/922,519 filed on Mar. 15, 2018, entitled “OVEN WALL COMPOSITIONSAND/OR STRUCTURES”. The entirety of the aforementioned application isincorporated by reference herein.

TECHNICAL FIELD

The subject disclosure relates to an oven with unique wall structures,and more specifically, to an oven with one or walls comprising lightweight materials and/or housing one or more sensors.

SUMMARY

The following presents a summary to provide a basic understanding of oneor more embodiments of the invention. This summary is not intended toidentify key or critical elements, or delineate any scope of theparticular embodiments or any scope of the claims. Its sole purpose isto present concepts in a simplified form as a prelude to the moredetailed description that is presented later. In one or more embodimentsdescribed herein, systems and/or apparatuses that can facilitate ovenefficiency and/or sensing capacities are provided.

According to an embodiment, an oven is provided. The oven comprising aheat source configured to heat a hollow space within the oven. The ovenfurther comprising an oven body that defines the hollow space, the ovenbody comprising a plurality of connected sides, wherein one or more ofthe connected sides comprise a plurality of carbon nanotubes.

According to another embodiment, an oven is provided. The ovencomprising a heat source configured to heat a hollow space within theoven. The oven further comprising an oven body that can define thehollow space and house a plurality of sensors. A first sensor of theplurality of sensors can be configured to monitor an environment of thehollow space. Also, a second sensor of the plurality of sensors can beconfigured to monitor an object located within the hollow space.

According to another embodiment, an oven system is provided. The ovensystem can comprise a processor, operably coupled to a memory, and thatcan execute the computer executable components stored in the memory. Theoven system can also comprise an oven body that can define a bakingarea. The oven body can comprise a plurality of walls, and the pluralityof walls can comprise a plurality of carbon nanotubes and a sensor. Thesensor can be operatively coupled to the processor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a diagram of an example, non-limiting cross-sectionof an oven comprising a plurality of wall layers in accordance with oneor more embodiments described herein.

FIG. 2 illustrates a diagram of an example, non-limiting cross-sectionof an oven comprising a plurality of wall layers that can house one ormore sensors in accordance with one or more embodiments describedherein.

FIG. 3 illustrates a diagram of an example, non-limiting cross-sectionof an oven comprising one or more removable oven wall dividers inaccordance with one or more embodiments described herein.

FIG. 4 illustrates a diagram of an example, non-limiting oven walldivider in accordance with one or more embodiments described herein.

FIG. 5 illustrates a diagram of an example, non-limiting cross-sectionof an oven comprising a plurality of wall layers that can house one ormore sensors in accordance with one or more embodiments described herein

FIG. 6 illustrates a diagram of an example, non-limiting cross-sectionof an oven comprising one or more oven wall dividers that can house oneor more sensors in accordance with one or more embodiments describedherein.

FIG. 7 illustrates a block diagram of an example, non-limiting operatingenvironment in which one or more embodiments described herein can befacilitated.

DETAILED DESCRIPTION

The following detailed description is merely illustrative and is notintended to limit embodiments and/or application or uses of embodiments.Furthermore, there is no intention to be bound by any expressed orimplied information presented in the preceding Background or Summarysections, or in the Detailed Description section.

One or more embodiments are now described with reference to thedrawings, wherein like referenced numerals are used to refer to likeelements throughout. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providea more thorough understanding of the one or more embodiments. It isevident, however, in various cases, that the one or more embodiments canbe practiced without these specific details.

FIG. 1 illustrates a diagram of an example, non-limiting cross-sectionof an oven 100 in accordance with one or more embodiments describedherein. While FIG. 1 illustrates a two-dimensional diagram, the oven 100can be a three-dimensional object, wherein the illustratedcross-sectional view can regard a cross-section of the oven 100 from adepth perspective or a width perspective. For example, thecross-sectional view of FIG. 1 can regard a perspective in which thefront and/or back of the oven 100 is cut away. In another example, thecross-sectional view of FIG. 1 can regard a perspective in which a sideof the oven 100 is cut away.

The oven 100 can comprise an oven body 101 having a top side 102, abottom side 104, a left side 106, and/or a right side 108. Each of thetop side 102, the bottom side 104, the left side 106, and/or the rightside 108 can comprise a plurality of wall layers. For example, FIG. 1illustrates the oven body 101 comprising three wall layers: an outerwall layer 110, an intermediate wall layer 112, and/or an inner walllayer 114. While FIG. 1 illustrates three wall layers, fewer oradditional wall layers are also envisaged. For instance, the oven body101 can comprise additional intermediate wall layers 112.

In one or more embodiments, each of the top side 102, the bottom side104, the left side 106, and/or the right side 108 can comprise the samenumber of wall layers (e.g., as shown in FIG. 1). In variousembodiments, the oven body 101 can comprise a first side with adifferent number of wall layers than a second side. For example, the topside 102 can comprise two wall layers while the right side 108 comprisesthree wall layers.

Similarly, in one or more embodiments each of the top side 102, thebottom side 104, the left side 106, and/or the right side 108 cancomprise wall layers of the same material and/or structure. In variousembodiments, the oven body 101 can comprise a first side having one ormore wall layers made of a different material and/or structure than asecond side. For example, the top side 102 can an inner wall layer 114made of a first material and the right side 108 can comprise an innerwall layer 114 made of a second material.

The outer wall layer 110 can comprise a wall layer of the oven body 101(e.g., the top side 102, the bottom side 104, the left side 106, and/orthe right side 108) that is furthest from a baking area 116 of the oven100 with respect to the other wall layers of a subject side of the ovenbody 101. The outer wall layer 110 can comprise the same material and/orhave one or more common physical properties throughout the oven body101. Alternatively, the outer wall layer 110 can a first material at aside of the oven body 101 and a second material at another side of theoven body 101. Thus, in various embodiments the outer wall layer 110 canhave one or more varying physical properties throughout the oven body101.

The baking area 116 can be a hollow space defined by the oven body 101wherein one or more objects can be placed in order to be subject tobaking by the oven 100. The baking area 116 can be heated by one or moreheat sources (not shown). Also, the one or more heat sources can bewithin the baking area 116 and/or within the oven body 101. One ofordinary skill in the art will recognize the multitude of heat sourceconfigurations that can accommodated by the oven body 101.

Additionally, the intermediate wall layer 112 can comprise a wall layerof the oven body 101 (e.g., the top side 102, the bottom side 104, theleft side 106, and/or the right side 108) located between the outer walllayer 110 and the inner wall layer 114. The intermediate wall layer 112can comprise the same material and/or have one or more common physicalproperties throughout the oven body 101. Alternatively, the intermediatewall layer 112 can a first material at a side of the oven body 101 and asecond material at another side of the oven body 101. Thus, in variousembodiments the intermediate wall layer 112 can have one or more varyingphysical properties throughout the oven body 101. Further, the number ofintermediate wall layers 112 that can comprise a subject side of theoven body 101 can remain constant and/or vary from one side to anotherside. Further, in various embodiments, one or more intermediate walllayers 112 can comprise a fluid gap (e.g., an air gap) between the outerwall layer 110 and the inner wall layer 114.

Moreover, the inner wall layer 114 can comprise a wall layer of the ovenbody 101 (e.g., the top side 102, the bottom side 104, the left side106, and/or the right side 108) that is closest to the baking area 116of the oven 100 with respect to the other wall layers of a subject sideof the oven body 101. The inner wall layer 114 can comprise the samematerial and/or have one or more common physical properties throughoutthe oven body 101. Alternatively, the inner wall layer 114 can a firstmaterial at a side of the oven body 101 and a second material at anotherside of the oven body 101. Thus, in various embodiments the inner walllayer 114 can have one or more varying physical properties throughoutthe oven body 101.

One or more of the wall layers (e.g., the outer wall layer 110, theintermediate wall layer 112, and/or the inner wall layer 114) cancomprise: iron, an iron composite, steal, a steal composite, one or moreplastics (e.g., one or more polycarbonates), one or more ceramics,aluminum, an aluminum composite, nickel, a nickel composite, brick,stone, cement, copper, a copper composite, nano-carbons materials (e.g.,carbon nanotubes and/or phenolic-impregnated carbon ablator (PICA)technology), rubber, glass, a combination thereof and/or the like.

In one or more embodiments, one or more of the wall layers (e.g., theouter wall layer 110, the intermediate wall layer 112, and/or the innerwall layer 114) can comprise nano-carbon technology. For example, one ormore of the wall layers can comprise carbon nanotubes. The carbonnanotubes can be single walled nanotubes and/or multiwalled nanotubes.The carbon nanotubes can be utilized as an additive in one or morematerials to form one or more of the wall layers. For example, carbonnanotubes can be used as an additive to ceramic, plastic, and/or glassmaterials in order increase the strength and/or shatter resistance ofsaid materials. Thus, carbon nanotubes can be utilized to providestrength to light weight materials so as to reduce the weight of theoven body 101. Carbon nanotube additives can be grown on and/or withinone or more materials of the wall layers with the assistance of acatalyst deposited on the subject material. The carbon nanotubes can begrown in one or more patterns and/or orientations based at least in parton the depositing of the catalyst. Additionally, carbon nanotubeadditives can be formed via a chemical vapor deposition (CVD) systemcomprising a hydrocarbon compound and a catalyst-bearing compound. Thus,carbon nanotube additives can also be added to a material withoutpattern. One of ordinary skill in the art will recognize the variety ofmethods that can be utilized to grow carbon nanotube additives inaccordance with known techniques in the art.

For example, the inner wall layer 114 of one or more sides of the ovenbody 101 can comprise carbon nanotube additives, thereby increases thestrength of the inner wall layer 114 while maintaining a lower weightthan would otherwise be achieved. In another example, the outer walllayer 110 of one or more sides of the oven body 101 can comprise carbonnanotube additives, thereby increases the strength of the outer walllayer 110 while maintaining a lower weight than would otherwise beachieved. In a further example, one or more intermediate wall layers 114can comprise carbon nanotube additives, thereby increases the strengthof the respective intermediate wall layer 112 while maintaining a lowerweight than would otherwise be achieved.

Additionally, carbon nanotubes can comprise a portion of a subject walllayer, rather than the entirety of said subject wall layer. For example,while a subject wall layer can be comprised of a first material (e.g., aplastic, ceramic, and/or glass), portions of said first material can beenhanced with carbon nanotube additives. For instance, areas of thesubject wall layer that are subject to higher stresses (e.g., physicalloads and/or temperature changes) than other areas of the subject walllayer can be reinforced with carbon nanotubes.

Moreover, carbon nanotube additives can be oriented vertically and/orhorizontally throughout a subject wall layer to achieve desired thermaldistribution throughout the oven body 101. Carbon nanotubes can be morethermally conductive along their length than along their width.Therefore, carbon nanotube additives comprising one or more of the walllayers (e.g., the outer wall layer 110, the one or more intermediatewall layers 112, and/or the inner wall layer 114) can be oriented so asto facilitate the direction of thermal conductivity within the oven body101. For example, carbon nanotube additives can traverse the length of asubject wall layer in order to thermal conduct heat along the subjectwall layer, and/or carbon nanotube additives can traverse the width of asubject wall layer to facilitate thermal conductivity through thesubject wall layer.

For example, the inner wall layer 114 of one or more sides (e.g., thetop side 102, the bottom side 104, the left side 106, and/or the rightside 108) can comprise carbon nanotube additives oriented so as todirect thermal conductivity throughout the baking area 116. Forinstance, carbon nanotube additives comprising the inner wall layer 114of the left side 106 and/or the right side 108 can be orientedvertically so as to thermally conduct heat towards the top side 102and/or the bottom side 104; and carbon nanotube additives comprising theinner wall layer 114 of the top side 102 and/or the bottom side 104 canbe oriented horizontally so as to thermally conduct heat towards theleft side 106 and/or the right side 108.

In addition, one or more wall layers can comprise carbon nanotubeadditives oriented in a variety of directions within the same wall layerin order facilitate and/or inhibit thermal conductivity of the subjectwall layer. For example, a wall layer (e.g., outer wall layer 110) cancomprise carbon nanotubes oriented in a variety of contradictorydirections so as to inhibit thermal conductivity through said walllayer. By changing the carbon nanotube orientation throughout the walllayer, the distribution of thermal energy through the wall layer can beinhibited. For instance, the outer wall layer 110 comprising one or moreof the sides (e.g., the top side 102, the bottom side 104, the left side106, and/or the right side 108) can comprise vertically oriented carbonnanotube additives adjacent to horizontally oriented carbon nanotubeadditives, wherein the difference in orientation can impede thermalconductivity between the carbon nanotubes. Impeding thermal conductivitycan be an advantageous property of one or more wall layers (e.g., theouter wall layer 110) that may be subject to interaction with a user ofthe oven 100 in order to reduce potential harm to the user.

In various embodiments, the oven body 101 can further comprise a coating118. The coating 118 can have a high or low emissivity depending on thedesired function of the coating 118 and/or the location of the oven's100 heat source (not shown). For example, wherein the heat source islocated outside the baking area 116 (e.g., within and/or in between oneor more of the wall layers), the coating 118 can have a high emissivityto facilitate the storing and/or releasing of heat. The coating 118 canbe located on the inner wall layer 114 nearest the baking area 116(e.g., as shown in FIG. 1). The coating 118 can comprise, for example:ceramic, clay, chrome, gypsum, iron (e.g., iron oxide), silicone carbide(e.g., carborundum), a plastic (e.g., a polycarbonate), a combinationthereof, and/or the like. Additionally, the coating 118 can facilitateprotecting the inner wall layer 114 from damage that may be inflicted bya product being backing within the baking area 116.

The coating 118 can be depositing on the oven 100 (e.g., the inner walllayer 114) via a variety of means, including, but not limited to:painting, spraying, spin-coating, CVD, dipping, a combination thereof,and/or the like. Furthermore, the coating 118 can enhance the inner walllayer's 114 endurance against substantial temperature changes.

FIG. 2 illustrates a diagram of the example, non-limiting oven 100comprising one or more sensors 202 in accordance with one or moreembodiments described herein. Repetitive description of like elementsemployed in other embodiments described herein is omitted for sake ofbrevity. The one or more sensors 202 can enable a user of the oven 100to monitor the conditions of the oven 100 and/or a product subject tobaking within the oven 100 without interrupting the baking processand/or exposing the user to environmental conditions within the oven100.

To facilitate monitoring the environmental conditions of the baking area116 and/or a product within the baking area 116, the oven 100 cancomprise one or more sensors 202 located within the oven body 101.Example sensors can include, but are not limited to: temperaturesensors, such as mechanical temperatures sensors (e.g., thermometersand/or laser thermometers) and/or electrical temperature sensors (e.g.,thermistor, thermocouples, and/or resistance temperature detectors),cameras (e.g., thermal imaging cameras, digital cameras, still imagecameras, and/or motion cameras), pressure sensors (e.g., scales,pressure transducers, pressure switches, barometers, analog pressuresensors (e.g., force collector types), digital pressure sensors, and/orthermal pressure sensors), lasers, hydrometers, air quality meters(e.g., devices to detect pollutants in an environment, such as carbondioxide levels, volatile organic compound levels, carbon monoxidelevels, and/or the like) a combination thereof, and/or the like.

The one or more sensors 202 can monitor environmental conditions of thebaking area 116 such as, but not limited to: temperature, pressure,humidity, air quality, a combination thereof, and/or the like. Forexample, one or more sensors 202 can comprise a pressure sensors thatcan measure the atmospheric pressure of the baking area 116 during abaking processes. In another example, the one or more sensors 202 cancomprise an air quality meter that can detect the presence of one ormore pollutants in the environment of the baking area 116, which mayform as a result of baking a subject product.

Further, the one or more sensors 202 can monitor one or more properties(e.g., physical properties) of a product within the baking area 116 suchas, but not limited to: weight of a subject product, size of subjectproduct, temperature of a subject product, density of a subject product,hardness of a subject product, a combination thereof, and/or the like.For example, one or more of the sensors 202 can comprise one or morepressure sensors can measure the weight of a product placed upon thesensors 202. In another example, one or more of the sensors 202 cancomprise thermal imaging cameras that can illustrate heat distributionthroughout the subject product as the product is subject to bakingwithin the baking area 116.

FIG. 2 illustrates the one or more sensors 202 located in the inner walllayer 114; however, the one or more sensors 202 can also extend to otherwall layers of the oven body 101. Additionally, the one or more sensors202 can be located in the intermediate wall layers 112 and/or the outerwall layer 110 without being located in the inner wall layer 114. Forexample, one or more pressure sensors can be located in one or moreintermediate wall layers 112 and can be triggered by deformation of theinner wall layer 114.

Further, while FIG. 2 illustrates four sensors 202, the oven body 101can comprise additional or fewer sensors 202. Further, although in theembodiment shown the one or more sensors 202 can comprise four sensors202 (e.g., one sensor 202 located in the left side 106, one sensor 202located in the right side 108, and two sensors located in the bottomside 104), it should be appreciated that the architecture of the ovenbody 101 is not so limited. The one or more sensors 202 can be locatedat various positions along any side (e.g., the top side 102, the bottomside 104, the left side 106, and/or the right side 108) of the oven body101. Further, each side of the oven body 101 can comprise a singlesensor 202 and/or a plurality of sensors 202. Additionally, differenttypes of the one or more sensors 202 can be located at differentpositions throughout the oven body 101 depending on the function of thesensors 202. For example, one or more pressure sensors can be located inthe bottom side 104, while one or more thermal sensors and/or lasers canbe located in the left side 106 and/or right side 108, and one or morecameras can be located in the top side 102. In another example, eachside of the oven body 101 can comprise one or more of the same sensors202.

Moreover, the one or more sensors 202 can be coupled to one or moreprocessors (e.g., a central processing unit (CPU)) to facilitatecollection and/or dissemination of the data collected by the one or moresensors 202. The one or more sensors can be coupled to the one or moreprocessors (not shown) through a wired connection and/or a wirelessconnection. For example, the one or more sensors 202 can be connected toone or more networks. The one or more networks can comprise wired andwireless networks, including, but not limited to, a cellular network, awide area network (WAN) (e.g., the Internet) or a local area network(LAN). For example, the one or more sensors 202 can communicate with theone or more processors (and vice versa) using virtually any desiredwired or wireless technology including for example, but not limited to:cellular, WAN, wireless fidelity (Wi-Fi), Wi-Max, WLAN, Bluetoothtechnology, cloud technology, a combination thereof, and/or the like.

FIG. 3 illustrates a diagram of the example, non-limiting oven 100further comprising one or more dividers 303. Repetitive description oflike elements employed in other embodiments described herein is omittedfor sake of brevity. The one or more dividers 302 can segregate portionsof the of the baking area 116. The baking area 116 can be segregated tofacilitate execution of different environmental conditions throughoutthe baking area 116 and/or to maintain separation between a plurality ofproducts within the baking area 116.

The divider 302 can comprise the same material as any of the walllayers. For example, the divider 302 can comprise iron, an ironcomposite, steal, a steal composite, one or more plastics (e.g., one ormore polycarbonates), one or more ceramics, aluminum, an aluminumcomposite, nickel, a nickel composite, brick, stone, cement, copper, acopper composite, nano-carbons materials (e.g., carbon nanotubes and/orphenolic-impregnated carbon ablator (PICA) technology), rubber, glass, acombination thereof and/or the like. In one or more embodiments, the oneor more dividers 302 can comprise carbon nanotube additives as describedherein with regard to the wall layers.

Additionally, the one or more dividers 302 can be removable from theoven body 101. For example, the one or more dividers 302 can attachand/or detach with the inner wall layer 114 of the oven body 101. Forexample, the one or more dividers 302 can slide into grooves and/orslots located in the inner wall layer 114 (e.g., on any of the sides ofthe oven body 101). In another example, the one or more dividers 302 canbe fastened to the inner wall layer 114.

Further, although FIG. 3 illustrates a single divider 302 oriented in avertical direction, it should be appreciated that the architecture ofthe oven 100 is not so limited. The oven 100 can comprise a plurality ofdividers 302. Also, the one or more dividers 302 can be oriented in avertical fashion (e.g., extending from the top side 102 to the bottomside 104) and/or a horizontal fashion (e.g., extending from the leftside 106 to the right side 108).

Moreover, the one or more dividers 302 can covered with the coating 118.As shown in FIG. 3, both sides of the one or more dividers 302 cancomprise the coating 118. Alternatively, one side of the dividers 302can comprise the coating 118 while another side of the divider 302 canbe absent of the coating 118. Additionally, one side of the one or moredividers 302 can comprise a first embodiment of the coating 118 (e.g.,an embodiment comprising ceramic) while a second side of the one or moredividers can comprise a second embodiment of the coating 118 (e.g.,another embodiment comprising a plastic). Altering the type of coating118 on each side of the one or more dividers 302 can facilitateexecution of alternate baking conditions in the separate regions formedwithin the baking area 116 by the one or more dividers 302. Furthermore,the one or more dividers 302 can comprise the same embodiment of coating118 as the embodiment of coating 118 comprising the inner wall layer 114or a different embodiment of coating 118 as the embodiment of coating118 comprising the inner wall layer 114.

FIG. 4 illustrates a diagram of an example, non-limiting divider 302that can comprise one or more vents 402 in accordance with one or moreembodiments described herein. Repetitive description of like elementsemployed in other embodiments described herein is omitted for sake ofbrevity. The one or more vents 402 can facilitate manipulation of theatmosphere in the baking area 116.

The one or more vents 402 can be configured to an open or closedposition, thereby permitting or inhibiting atmosphere from traversingfrom one region of the baking area 116 to another region of the bakingarea 116. In one or more embodiments, the one or more vents 402 can beopened and/or closed manually. In various embodiments, the one or morevents 402 can be opened and/or closed remotely. For example, the one ormore vents 402 can be coupled to one or more actuators. Further, the oneor more actuators can be coupled to a processor via a network (e.g., asdescribed herein with regard to couple the one or more sensors 202 to aprocessor).

Further, although FIG. 4 illustrates four vents 402, it should beappreciated that the architecture of the divider 302 is not so limited.For example, the one or more dividers 302 can comprise fewer oradditional vents 402 than the four shown in FIG. 4. Additionally, theone or more vents 402 can be opened and/or closed independently of eachother and/or simultaneously. Through manipulation of the one or morevents 402, a user of the oven 100 can control the distribution ofatmosphere amongst various regions of the baking area 116.

FIG. 5 illustrates a diagram of the example, non-limiting oven 100further comprising the coating 118 covering one or more sensors 202.Repetitive description of like elements employed in other embodimentsdescribed herein is omitted for sake of brevity. As shown in FIG. 5, oneor more of the sensors 202 can be covered, entirely and/or partially, bythe coating 118.

Covering one or more of the sensors 202 with the coating 118 canfacilitate protection of the sensors 202 and/or thermal unity of thebaking area 116. For example, one or more of the sensors 202 can bepressure sensors, which can be calibrated to accommodate for anypressure changes caused by the coating 118. Further, the coating 118covering the pressure sensors can have a high emissivity (e.g., greaterthan or equal to 0.8 and less than or equal to 1); thereby allowing thecoating 118 to absorb thermal energy and radiate said thermal energyover an area covering the pressure sensors 202. Thus, covering thepressure sensors with the coating 118 can facilitate a distribution ofthermal energy across the entirety of the inner wall layer 114 withoutimpeding the measurements of the subject one or more sensors 202.

Additionally, as shown in FIG. 5, the oven 100 can comprise both:sensors 202 covered with the coating 118; and sensors 202 not coveredwith the coating 118. Wherein covering a sensor with the coating 118would impede the detecting capacity of the sensor 202, the coating 118can be absent the section of the inner wall layer 114 that houses saidsensor 202. For example, the coating 118 could impede a camera's (e.g.,a thermal imaging camera) ability to capture images of the baking area116, and thus, covering the camera with the coating 118 can be avoided.

FIG. 6 illustrates a diagram of the example, non-limiting oven 100further comprising one or more dividers 302 having one or more sensors202 in accordance with one or more embodiments described herein.Repetitive description of like elements employed in other embodimentsdescribed herein is omitted for sake of brevity.

As shown in FIG. 6, one or more of the dividers 302 can comprise one ormore of the sensors 202. As described herein, one or more sensors 202housed within the divider 302 can be coupled to a processor via one ormore networks. Further, one or more sensors 202 housed within thedivider 302 can be covered or not covered by one or more embodiments ofthe coating 118. Further, although FIG. 6 illustrates a single sensor202 comprising a single divider 302, it should be appreciated that thearchitecture of the divider 302 is not so limited. A subject divider 302can comprise a plurality of sensors 202. Also, the oven 100 can comprisea plurality of dividers 302 each comprising one or more sensors 202.Moreover, respective dividers 302 can comprise the same types of thesensors 202 and/or different types of sensors 202.

Through use of a divider 302 comprising a sensor 202, a user of the oven100 can strategically place one or more sensors 202 at various locationswithin the baking area 116 in order to monitor various perspectives ofthe baking area's 116 environment and/or products. Additionally, the oneor more dividers 302 can comprise one or more sensors 202 that the ovenbody 101 does not comprise; thereby enabling a user of the oven 100 tomonitor baking and/or product variables that otherwise would not beobtainable by the oven's 100 standard configuration (e.g., aconfiguration that does not include the one or more dividers 302).Furthermore, the dividers 302 can enable a user of the oven 100 toupdate the oven's 100 monitoring capacity without renovating the oven100. For example, as sensing technology advances, state-of-the-artsensors 202 can be incorporated into dividers 302 at a lower cost thanwould otherwise be incurred to renovate the oven body 101 to includesaid sensors 202.

To provide a context for the various aspects of the disclosed subjectmatter, FIG. 7 as well as the following discussion are intended toprovide a general description of a suitable environment in which thevarious aspects of the disclosed subject matter can be implemented. Forexample, FIG. 7 can provide context for operation of the one or moresensors 202 and/or the one or more vents 402, which can be coupled to aprocessor and/or remotely controlled (e.g., via computerizedassistance). The environment depicted in FIG. 7 can be located withinthe oven 100, adjacent to the oven 100, and/or separate from the oven100. For example, the oven body 101 can house the computer 702, or thecomputer can be located outside the oven body 101 (e.g., adjacent to theoven body 101 or a separate location than the oven 100).

FIG. 7 illustrates a block diagram of an example, non-limiting operatingenvironment in which one or more embodiments described herein can befacilitated. Repetitive description of like elements employed in otherembodiments described herein is omitted for sake of brevity. Withreference to FIG. 7, a suitable operating environment 700 forimplementing various aspects of this disclosure can include a computer702. The computer 702 can also include a processing unit 704, a systemmemory 706, and a system bus 708. The system bus 708 can operably couplesystem components including, but not limited to, the system memory 706to the processing unit 704. The processing unit 704 can be any ofvarious available processors. Dual microprocessors and othermultiprocessor architectures also can be employed as the processing unit704. The system bus 708 can be any of several types of bus structuresincluding the memory bus or memory controller, a peripheral bus orexternal bus, and/or a local bus using any variety of available busarchitectures including, but not limited to, Industrial StandardArchitecture (ISA), Micro-Channel Architecture (MSA), Extended ISA(EISA), Intelligent Drive Electronics (IDE), VESA Local Bus (VLB),Peripheral Component Interconnect (PCI), Card Bus, Universal Serial Bus(USB), Advanced Graphics Port (AGP), Firewire, and Small ComputerSystems Interface (SCSI). The system memory 706 can also includevolatile memory 710 and nonvolatile memory 712. The basic input/outputsystem (BIOS), containing the basic routines to transfer informationbetween elements within the computer 702, such as during start-up, canbe stored in nonvolatile memory 712. By way of illustration, and notlimitation, nonvolatile memory 712 can include read only memory (ROM),programmable ROM (PROM), electrically programmable ROM (EPROM),electrically erasable programmable ROM (EEPROM), flash memory, ornonvolatile random access memory (RAM) (e.g., ferroelectric RAM (FeRAM).Volatile memory 710 can also include random access memory (RAM), whichacts as external cache memory. By way of illustration and notlimitation, RAM is available in many forms such as static RAM (SRAM),dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM(DDR SDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), directRambus RAM (DRRAM), direct Rambus dynamic RAM (DRDRAM), and Rambusdynamic RAM.

Computer 702 can also include removable/non-removable,volatile/non-volatile computer storage media. FIG. 7 illustrates, forexample, a disk storage 714. Disk storage 714 can also include, but isnot limited to, devices like a magnetic disk drive, floppy disk drive,tape drive, Jaz drive, Zip drive, LS-100 drive, flash memory card, ormemory stick. The disk storage 714 also can include storage mediaseparately or in combination with other storage media including, but notlimited to, an optical disk drive such as a compact disk ROM device(CD-ROM), CD recordable drive (CD-R Drive), CD rewritable drive (CD-RWDrive) or a digital versatile disk ROM drive (DVD-ROM). To facilitateconnection of the disk storage 714 to the system bus 708, a removable ornon-removable interface can be used, such as interface 716. FIG. 7 alsodepicts software that can act as an intermediary between users and thebasic computer resources described in the suitable operating environment700. Such software can also include, for example, an operating system718. Operating system 718, which can be stored on disk storage 714, actsto control and allocate resources of the computer 702. Systemapplications 720 can take advantage of the management of resources byoperating system 718 through program modules 722 and program data 724,e.g., stored either in system memory 706 or on disk storage 714. It isto be appreciated that this disclosure can be implemented with variousoperating systems or combinations of operating systems. A user enterscommands or information into the computer 702 through one or more inputdevices 726. Input devices 726 can include, but are not limited to, apointing device such as a mouse, trackball, stylus, touch pad, keyboard,microphone, joystick, game pad, satellite dish, scanner, TV tuner card,digital camera, digital video camera, web camera, and the like. Theseand other input devices can connect to the processing unit 704 throughthe system bus 708 via one or more interface ports 728. The one or moreInterface ports 728 can include, for example, a serial port, a parallelport, a game port, and a universal serial bus (USB). One or more outputdevices 730 can use some of the same type of ports as input device 726.Thus, for example, a USB port can be used to provide input to computer702, and to output information from computer 702 to an output device730. Output adapter 732 can be provided to illustrate that there aresome output devices 730 like monitors, speakers, and printers, amongother output devices 730, which require special adapters. The outputadapters 732 can include, by way of illustration and not limitation,video and sound cards that provide a means of connection between theoutput device 730 and the system bus 708. It should be noted that otherdevices and/or systems of devices provide both input and outputcapabilities such as one or more remote computers 734.

Computer 702 can operate in a networked environment using logicalconnections to one or more remote computers 734, such as remote computer734. The remote computer 734 can be a computer, a server, a router, anetwork PC, a workstation, a microprocessor based appliance, a peerdevice or other common network node and the like, and typically can alsoinclude many or all of the elements described relative to computer 702.For purposes of brevity, only a memory storage device 736 is illustratedwith remote computer 734. Remote computer 734 can be logically connectedto computer 702 through a network interface 738 and then physicallyconnected via communication connection 740. Further, operation can bedistributed across multiple (local and remote) systems. Networkinterface 738 can encompass wire and/or wireless communication networkssuch as local-area networks (LAN), wide-area networks (WAN), cellularnetworks, etc. LAN technologies include Fiber Distributed Data Interface(FDDI), Copper Distributed Data Interface (CDDI), Ethernet, Token Ringand the like. WAN technologies include, but are not limited to,point-to-point links, circuit switching networks like IntegratedServices Digital Networks (ISDN) and variations thereon, packetswitching networks, and Digital Subscriber Lines (DSL). One or morecommunication connections 740 refers to the hardware/software employedto connect the network interface 738 to the system bus 708. Whilecommunication connection 740 is shown for illustrative clarity insidecomputer 702, it can also be external to computer 702. Thehardware/software for connection to the network interface 738 can alsoinclude, for exemplary purposes only, internal and external technologiessuch as, modems including regular telephone grade modems, cable modemsand DSL modems, ISDN adapters, and Ethernet cards.

Embodiments of the present invention can be a system, a method, anapparatus and/or a computer program product at any possible technicaldetail level of integration. The computer program product can include acomputer readable storage medium (or media) having computer readableprogram instructions thereon for causing a processor to carry outaspects of the present invention. The computer readable storage mediumcan be a tangible device that can retain and store instructions for useby an instruction execution device. The computer readable storage mediumcan be, for example, but is not limited to, an electronic storagedevice, a magnetic storage device, an optical storage device, anelectromagnetic storage device, a semiconductor storage device, or anysuitable combination of the foregoing. A non-exhaustive list of morespecific examples of the computer readable storage medium can alsoinclude the following: a portable computer diskette, a hard disk, arandom access memory (RAM), a read-only memory (ROM), an erasableprogrammable read-only memory (EPROM or Flash memory), a static randomaccess memory (SRAM), a portable compact disc read-only memory (CD-ROM),a digital versatile disk (DVD), a memory stick, a floppy disk, amechanically encoded device such as punch-cards or raised structures ina groove having instructions recorded thereon, and any suitablecombination of the foregoing. A computer readable storage medium, asused herein, is not to be construed as being transitory signals per se,such as radio waves or other freely propagating electromagnetic waves,electromagnetic waves propagating through a waveguide or othertransmission media (e.g., light pulses passing through a fiber-opticcable), or electrical signals transmitted through a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network can includecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device. Computer readable programinstructions for carrying out operations of various aspects of thepresent invention can be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, configuration data for integrated circuitry, oreither source code or object code written in any combination of one ormore programming languages, including an object oriented programminglanguage such as Smalltalk, C++, or the like, and procedural programminglanguages, such as the “C” programming language or similar programminglanguages. The computer readable program instructions can executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer can be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection can be made to anexternal computer (for example, through the Internet using an InternetService Provider). In some embodiments, electronic circuitry including,for example, programmable logic circuitry, field-programmable gatearrays (FPGA), or programmable logic arrays (PLA) can execute thecomputer readable program instructions by utilizing state information ofthe computer readable program instructions to customize the electroniccircuitry, in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toblock diagrams of methods, apparatus (systems), and computer programproducts according to embodiments of the invention. It will beunderstood that each block of the block diagrams, and combinations ofblocks in the block diagrams, can be implemented by computer readableprogram instructions. These computer readable program instructions canbe provided to a processor of a general purpose computer, specialpurpose computer, or other programmable data processing apparatus toproduce a machine, such that the instructions, which execute via theprocessor of the computer or other programmable data processingapparatus, create means for implementing the functions/acts specified inthe block diagram block or blocks. These computer readable programinstructions can also be stored in a computer readable storage mediumthat can direct a computer, a programmable data processing apparatus,and/or other devices to function in a particular manner, such that thecomputer readable storage medium having instructions stored thereinincludes an article of manufacture including instructions whichimplement aspects of the function/act specified in the block diagramblock or blocks. The computer readable program instructions can also beloaded onto a computer, other programmable data processing apparatus, orother device to cause a series of operational acts to be performed onthe computer, other programmable apparatus or other device to produce acomputer implemented process, such that the instructions which executeon the computer, other programmable apparatus, or other device implementthe functions/acts specified in the block diagram block or blocks.

The block diagrams in the Figures illustrate the architecture,functionality, and operation of possible implementations of systems,methods, and computer program products according to various embodimentsof the present invention. In this regard, each block in the blockdiagrams can represent a module, segment, or portion of instructions,which includes one or more executable instructions for implementing thespecified logical function(s). In some alternative implementations, thefunctions noted in the blocks can occur out of the order noted in theFigures. For example, two blocks shown in succession can, in fact, beexecuted substantially concurrently, or the blocks can sometimes beexecuted in the reverse order, depending upon the functionalityinvolved. It will also be noted that each block of the block diagramsillustration, and combinations of blocks in the block diagramsillustration, can be implemented by special purpose hardware-basedsystems that perform the specified functions or acts or carry outcombinations of special purpose hardware and computer instructions.

While the subject matter has been described above in the general contextof computer-executable instructions of a computer program product thatruns on a computer and/or computers, those skilled in the art willrecognize that this disclosure also can or can be implemented incombination with other program modules. Generally, program modulesinclude routines, programs, components, data structures, etc. thatperform particular tasks and/or implement particular abstract datatypes. Moreover, those skilled in the art will appreciate that theinventive computer-implemented methods can be practiced with othercomputer system configurations, including single-processor ormultiprocessor computer systems, mini-computing devices, mainframecomputers, as well as computers, hand-held computing devices (e.g., PDA,phone), microprocessor-based or programmable consumer or industrialelectronics, and the like. The illustrated aspects can also be practicedin distributed computing environments where tasks are performed byremote processing devices that are linked through a communicationsnetwork. However, some, if not all aspects of this disclosure can bepracticed on stand-alone computers. In a distributed computingenvironment, program modules can be located in both local and remotememory storage devices.

As used in this application, the terms “component,” “system,”“platform,” “interface,” and the like, can refer to and/or can include acomputer-related entity or an entity related to an operational machinewith one or more specific functionalities. The entities disclosed hereincan be either hardware, a combination of hardware and software,software, or software in execution. For example, a component can be, butis not limited to being, a process running on a processor, a processor,an object, an executable, a thread of execution, a program, and/or acomputer. By way of illustration, both an application running on aserver and the server can be a component. One or more components canreside within a process and/or thread of execution and a component canbe localized on one computer and/or distributed between two or morecomputers. In another example, respective components can execute fromvarious computer readable media having various data structures storedthereon. The components can communicate via local and/or remoteprocesses such as in accordance with a signal having one or more datapackets (e.g., data from one component interacting with anothercomponent in a local system, distributed system, and/or across a networksuch as the Internet with other systems via the signal). As anotherexample, a component can be an apparatus with specific functionalityprovided by mechanical parts operated by electric or electroniccircuitry, which is operated by a software or firmware applicationexecuted by a processor. In such a case, the processor can be internalor external to the apparatus and can execute at least a part of thesoftware or firmware application. As yet another example, a componentcan be an apparatus that provides specific functionality throughelectronic components without mechanical parts, wherein the electroniccomponents can include a processor or other means to execute software orfirmware that confers at least in part the functionality of theelectronic components. In an aspect, a component can emulate anelectronic component via a virtual machine, e.g., within a cloudcomputing system.

In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” That is, unless specified otherwise, or clearfrom context, “X employs A or B” is intended to mean any of the naturalinclusive permutations. That is, if X employs A; X employs B; or Xemploys both A and B, then “X employs A or B” is satisfied under any ofthe foregoing instances. Moreover, articles “a” and “an” as used in thesubject specification and annexed drawings should generally be construedto mean “one or more” unless specified otherwise or clear from contextto be directed to a singular form. As used herein, the terms “example”and/or “exemplary” are utilized to mean serving as an example, instance,or illustration. For the avoidance of doubt, the subject matterdisclosed herein is not limited by such examples. In addition, anyaspect or design described herein as an “example” and/or “exemplary” isnot necessarily to be construed as preferred or advantageous over otheraspects or designs, nor is it meant to preclude equivalent exemplarystructures and techniques known to those of ordinary skill in the art.

As it is employed in the subject specification, the term “processor” canrefer to substantially any computing processing unit or deviceincluding, but not limited to, single-core processors; single-processorswith software multithread execution capability; multi-core processors;multi-core processors with software multithread execution capability;multi-core processors with hardware multithread technology; parallelplatforms; and parallel platforms with distributed shared memory.Additionally, a processor can refer to an integrated circuit, anapplication specific integrated circuit (ASIC), a digital signalprocessor (DSP), a field programmable gate array (FPGA), a programmablelogic controller (PLC), a complex programmable logic device (CPLD), adiscrete gate or transistor logic, discrete hardware components, or anycombination thereof designed to perform the functions described herein.Further, processors can exploit nano-scale architectures such as, butnot limited to, molecular and quantum-dot based transistors, switchesand gates, in order to optimize space usage or enhance performance ofuser equipment. A processor can also be implemented as a combination ofcomputing processing units. In this disclosure, terms such as “store,”“storage,” “data store,” data storage,” “database,” and substantiallyany other information storage component relevant to operation andfunctionality of a component are utilized to refer to “memorycomponents,” entities embodied in a “memory,” or components including amemory. It is to be appreciated that memory and/or memory componentsdescribed herein can be either volatile memory or nonvolatile memory, orcan include both volatile and nonvolatile memory. By way ofillustration, and not limitation, nonvolatile memory can include readonly memory (ROM), programmable ROM (PROM), electrically programmableROM (EPROM), electrically erasable ROM (EEPROM), flash memory, ornonvolatile random access memory (RAM) (e.g., ferroelectric RAM (FeRAM).Volatile memory can include RAM, which can act as external cache memory,for example. By way of illustration and not limitation, RAM is availablein many forms such as synchronous RAM (SRAM), dynamic RAM (DRAM),synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhancedSDRAM (ESDRAM), Synchlink DRAM (SLDRAM), direct Rambus RAM (DRRAM),direct Rambus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM).Additionally, the disclosed memory components of systems orcomputer-implemented methods herein are intended to include, withoutbeing limited to including, these and any other suitable types ofmemory.

What has been described above include mere examples of systems, computerprogram products and computer-implemented methods. It is, of course, notpossible to describe every conceivable combination of components,products and/or computer-implemented methods for purposes of describingthis disclosure, but one of ordinary skill in the art can recognize thatmany further combinations and permutations of this disclosure arepossible. Furthermore, to the extent that the terms “includes,” “has,”“possesses,” and the like are used in the detailed description, claims,appendices and drawings such terms are intended to be inclusive in amanner similar to the term “comprising” as “comprising” is interpretedwhen employed as a transitional word in a claim. The descriptions of thevarious embodiments have been presented for purposes of illustration,but are not intended to be exhaustive or limited to the embodimentsdisclosed. Many modifications and variations will be apparent to thoseof ordinary skill in the art without departing from the scope and spiritof the described embodiments. The terminology used herein was chosen tobest explain the principles of the embodiments, the practicalapplication or technical improvement over technologies found in themarketplace, or to enable others of ordinary skill in the art tounderstand the embodiments disclosed herein.

What is claimed is:
 1. An oven system, comprising: a memory that stores computer executable components; a processor, operably coupled to the memory, that executes the computer executable components; and an oven body that defines a baking area, wherein the oven body comprises a dividing wall that segregates the baking area into multiple baking areas, and wherein the dividing wall includes carbon nanotubes and a sensor that is operatively coupled to the processor.
 2. The oven system of claim 1, wherein the oven body further comprises a second sensor, wherein the computer executable components cause the processor to configure the sensor to monitor an atmosphere of the baking area, and wherein the computer executable components cause the processor to configure the second sensor to monitor an object within the baking area.
 3. The oven system of claim 2, further comprising an adjustable vent operatively coupled to the processor, wherein the computer executable components cause the processor to adjust the adjustable vent based on data from the sensor.
 4. The oven system of claim 3, wherein an adjustment of the adjustable vent by the processor manipulates a distribution of the atmosphere between two or more baking areas of the multiple baking areas.
 5. The oven system of claim 2, wherein the oven body further comprises a plurality of walls that include a plurality of carbon nanotubes oriented to direct thermal conductivity within the oven body.
 6. The oven system of claim 3, wherein the dividing wall is removably attached to one or more of the plurality of walls.
 7. An oven system, comprising: a memory that stores computer executable components; a processor, operably coupled to the memory, that executes the computer executable components; an oven body that defines a baking area, wherein the oven body comprises a dividing wall that segregates the baking area into multiple baking areas; and a sensor operably coupled to the processor and included in the dividing wall, wherein the sensor collects data regarding an atmosphere of at least one of the multiple baking areas.
 8. The oven system of claim 7, further comprising: an adjustable vent operably coupled to the processor and included in the dividing wall, wherein operation of the adjustable vent manipulates a distribution of the atmosphere between two or more baking areas of the multiple baking areas.
 9. The oven system of claim 8, wherein the computer executable components cause the processor to control the operation of the adjustable vent based on the data collected by the sensor.
 10. The oven system of claim 7, further comprising: a second sensor operably coupled to the processor and included in a wall of the oven body, wherein the second sensor collects baking data regarding an object positioned in the baking area.
 11. The oven system of claim 7, wherein the oven body comprises a plurality of walls that include carbon nanotubes oriented to direct thermal conductivity in the baking area.
 12. The oven system of claim 11, wherein the dividing wall is removably attached to the plurality of walls.
 13. The oven system of claim 7, wherein the sensor is an air quality sensor configured to measure an amount of volatile organic compounds within the at least one of the multiple baking areas.
 14. An oven system, comprising a processor operably coupled to a non-transitory computer-readable medium that includes computer executable components; an oven body that defines a baking area that is segregated into multiple baking areas by a dividing wall; and an adjustable vent operably coupled to the processor and included in the dividing wall, wherein operation of the adjustable vent controls a distribution of atmosphere between two or more baking areas of the multiple baking areas.
 15. The oven system of claim 14, further comprising: a sensor operably coupled to the processor and included in the dividing wall, wherein the sensor is configured to collect data regarding the atmosphere of at least one of the two or more baking areas of the multiple baking areas.
 16. The oven system of claim 15, further comprising: a second sensor operably coupled to the processor and included in the oven body, wherein the second sensor is configured to collect baking data regarding an object positioned in the baking area.
 17. The oven system of claim 15, wherein the sensor is an air quality sensor configured to measure an amount of volatile organic compounds within the at least one of the multiple baking areas.
 18. The oven system of claim 15, wherein the computer executable components cause the processor to control the operation of the adjustable vent based on the data collected by the sensor.
 19. The oven system of claim 18, wherein the oven body comprises a plurality of walls that include carbon nanotubes oriented to direct thermal conductivity in the baking area.
 20. The oven system of claim 19, wherein the dividing wall is removably attached to the plurality of walls. 